EDA’s CAEML Grows More Humps: Al Expands Role in Design

John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the Center for Co-Design of Chip, Package, System (C3PS), Georgia Tech.
Feb 15, 2018 - Atlanta, GA
The use of AI in EDA is a hot topic due to significant progress with applying machine learning to the issues of chip design.
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