Georgia Tech’s Center for Co-design of Chip, Package System (C3PS) partners with Notre Dame in $26 million multi-university research center developing next-generation computing technologies

John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the Center for Co-Design of Chip, Package, System (C3PS), Georgia Tech.
Jan 26, 2018 - Atlanta, GA
Georgia Tech’s Center for Co-design of Chip, Package System (C3PS) led by Profs. A. Raychowdhury and M. Swaminathan headed-up Georgia Tech’s winning proposal that resulted in a 5 year, $3.5M award that will fund up to 10 GRA positions.

EDA’s CAEML Grows More Humps: Al Expands Role in Design

John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the Center for Co-Design of Chip, Package, System (C3PS), Georgia Tech.
Feb 15, 2018 - Atlanta, GA
The use of AI in EDA is a hot topic due to significant progress with applying machine learning to the issues of chip design.

Yu to Receive Inaugural SRC Young Faculty Award

Shimeng Yu
Aug 19, 2019 - Atlanta, GA
ECE Associate Professor Shimeng Yu has been named as the recipient of the inaugural Semiconductor Research Corporation (SRC) Young Faculty Award.
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