Georgia Tech’s Center for Co-design of Chip, Package System (C3PS) partners with Notre Dame in $26 million multi-university research center developing next-generation computing technologies

John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the Center for Co-Design of Chip, Package, System (C3PS), Georgia Tech.
Jan 26, 2018 - Atlanta, GA
Georgia Tech’s Center for Co-design of Chip, Package System (C3PS) led by Profs. A. Raychowdhury and M. Swaminathan headed-up Georgia Tech’s winning proposal that resulted in a 5 year, $3.5M award that will fund up to 10 GRA positions.

EDA’s CAEML Grows More Humps: Al Expands Role in Design

John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE) and Director of the Center for Co-Design of Chip, Package, System (C3PS), Georgia Tech.
Feb 15, 2018 - Atlanta, GA
The use of AI in EDA is a hot topic due to significant progress with applying machine learning to the issues of chip design.

Spring 2018 IEN Seed Grant Winners Announced

Fall 2017 Seed Grant Winner at the IEN User Poster Session on May 21, 2018 - Arith Rajapaks
Jun 04, 2018 - Atlanta, GA
In keeping with the interdisciplinary mission of IEN, the projects that will be enabled by the grants include research in materials, biomedicine, energy production, and microelectronics packaging applications.
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