Georgia Tech’s Center for Co-design of Chip, Package System (C3PS) partners with Notre Dame in $26 million multi-university research center developing next-generation computing technologies
Jan 26, 2018 — Atlanta, GA

Georgia Tech’s Center for Co-design of Chip, Package System (C3PS) led by Profs. A. Raychowdhury and M. Swaminathan headed-up Georgia Tech’s winning proposal that resulted in a 5 year, $3.5M award that will fund up to 10 GRA positions.

EDA’s CAEML Grows More Humps: Al Expands Role in Design
Feb 15, 2018 — Atlanta, GA

The use of AI in EDA is a hot topic due to significant progress with applying machine learning to the issues of chip design.

Spring 2018 IEN Seed Grant Winners Announced
Jun 04, 2018 — Atlanta, GA

In keeping with the interdisciplinary mission of IEN, the projects that will be enabled by the grants include research in materials, biomedicine, energy production, and microelectronics packaging applications.

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