Georgia Tech’s Center for Co-design of Chip, Package System (C3PS) led by Profs. A. Raychowdhury and M. Swaminathan headed-up Georgia Tech’s winning proposal that resulted in a 5 year, $3.5M award that will fund up to 10 GRA positions.

The use of AI in EDA is a hot topic due to significant progress with applying machine learning to the issues of chip design.

In keeping with the interdisciplinary mission of IEN, the projects that will be enabled by the grants include research in materials, biomedicine, energy production, and microelectronics packaging applications.

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